NCP3420 データシートの表示（PDF） - ON Semiconductor
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NCP3420 Datasheet PDF : 9 Pages
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NCP3420
PACKAGE DIMENSIONS
DFN8 3x3, 0.5P
CASE 506BJ−01
ISSUE O
D
A
B
PIN 1
REFERENCE
ÇÇÇ 2X
ÇÇÇÇÇÇ 0.10 C
E
2X
0.10 C TOP VIEW
0.05 C
DETAIL B
8X
0.05 C
NOTE 4
(A3)
SIDE VIEW
A1
EDGE OF PACKAGE
L
L1
DETAIL A
OPTIONAL
CONSTRUCTION
L
DETAIL A
OPTIONAL
CONSTRUCTION
A
C
SEATING
PLANE
NOTES:
1. DIMENSIONS AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND 0.30
MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
MILLIMETERS
DIM MIN MAX
A 0.80 1.00
A1 0.00 0.05
A3 0.20 REF
b 0.18 0.30
D 3.00 BSC
D2 1.64 1.84
E 3.00 BSC
E2 1.35 1.55
e 0.50 BSC
K 0.20 −−−
L 0.30 0.50
L1 0.00 0.03
SOLDERMASK DEFINED
MOUNTING FOOTPRINT
8X L
D2
DETAIL A
1
4
E2
8X K
ÉÉÉÉ EXPOSED Cu
MOLD CMPD
DETAIL B
OPTIONAL
CONSTRUCTION
3.30
1.85
8X
0.35
1.55
8
5
e
BOTTOM VIEW
8X b
0.10 C A B
0.05 C NOTE 3
8X 0.63
0.50
PITCH
DIMENSION: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
8
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