STA510F(2007) データシートの表示（PDF） - STMicroelectronics

部品番号

コンポーネント説明

メーカー

STA510F
(Rev.:2007)

44-V, 5.5-A, quad power half bridge

STMicroelectronics 

Package information

3

Package information

STA510F

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a Lead-free second level interconnect. The category of

second Level Interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: http://www.st.com.

Figure 7. PowerSO36 package dimensions

mm

inch

DIM.

MIN. TYP. MAX. MIN. TYP. MAX.

A 3.25

3.43 0.128

0.135

A2 3.1

3.2 0.122

0.126

A4 0.8

1 0.031

0.039

A5

0.2

0.008

a1 0.030

-0.040 0.0011

-0.0015

b 0.22

0.38 0.008

0.015

c 0.23

0.32 0.009

0.012

D 15.8

16 0.622

0.630

D1 9.4

9.8 0.37

0.38

D2

1

0.039

E 13.9

14.5 0.547

0.57

E1 10.9

11.1 0.429

0.437

E2

2.9

0.114

E3 5.8

6.2 0.228

0.244

E4 2.9

3.2 0.114

1.259

e

0.65

0.026

e3

11.05

0.435

G

0

0.075 0

0.003

H 15.5

15.9 0.61

0.625

h

1.1

0.043

L

0.8

1.1 0.031

0.043

N

10˚

10˚

s

8˚

8˚

(1) “D and E1” do not include mold flash or protusions.

Mold flash or protusions shall not exceed 0.15mm (0.006”)

(2) No intrusion allowed inwards the leads.

OutlineOaUnTdLmINeEchAaNnDical data

MECHANICAL DATA

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8/11

7183931 D

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