HCPL-0710-560E(2013) データシートの表示（PDF） - Avago Technologies
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HCPL-0710-560E Datasheet PDF : 17 Pages
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Package Outline Drawing
HCPL-0710 Outline Drawing (Small Outline SO-8 Package)
LAND PATTERN RECOMMENDATION
8765
3.937 ± 0.127
XXXV
YWW
(0.155 ± 0.005)
5.994 ± 0.203
(0.236 ± 0.008)
TYPE NUMBER
(LAST 3 DIGITS)
DATE CODE
PIN ONE 1 2 3 4
0.406 ± 0.076
(0.016 ± 0.003)
1.270
(0.050)
BSC
7.49 (0.295)
1.9 (0.075)
0.64 (0.025)
* 5.080 ± 0.127
(0.200 ± 0.005)
7°
45°
X
0.432
(0.017)
3.175 ± 0.127
(0.125 ± 0.005)
1.524
(0.060)
0 ~ 7°
0.228 ± 0.025
(0.009 ± 0.001)
* TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)
5.207 ± 0.254 (0.205 ± 0.010)
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.
OPTION NUMBER 500 NOT MARKED.
NOTE: FLOATING LEAD PROTRUSION IS 0.15 mm (6 mils) MAX.
0.203 ± 0.102
(0.008 ± 0.004)
0.305
(0.012)
MIN.
Solder Reflow Thermal Profile
Recommended reflow condition as per JEDEC Standard,
J-STD-020 (latest revision). Non-Halide Flux should be
used.
Regulatory Information
The HCPL-x710 have been approved by the following organizations:
UL
Recognized under UL 1577, component recognition
program, File E55361.
CSA
Approved under CSA Component Acceptance Notice
#5, File CA 88324.
IEC/EN/DIN EN 60747-5-5
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