NCL30000 データシートの表示（PDF） - ON Semiconductor

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NCL30000

Power Factor Corrected Dimmable LED Driver

ON Semiconductor 

NCL30000

Overview

Figure 2 illustrates how the NCL30000 is configured to

implement an isolated power factor corrected flyback

switch mode power supply. On the secondary side is the

NCS1002, a constant voltage, constant current controller

which senses the average LED current and the output

voltage and provides a feedback control signal to the

primary side through an opto-coupler interface. One of the

key benefits of active power factor correction is that it makes

the load appear like a linear resistance similar to an

incandescent bulb. High power factor requires generally

sinusoidal line current and minimal phase displacement

between the line current and voltage. The NCL30000

operates in a fixed on-time variable frequency mode where

the power switch is on for the same length of time over a half

cycle of input power. The current in the primary of the

transformer starts at zero each switching cycle and is directly

proportional to the applied voltage times the on-time.

Therefore with a fixed on-time, the current will follow the

applied voltage generating a current of the same shape. Just

as in a traditional boost PFC circuit, the control bandwidth

is low so that the on-time is constant throughout a single line

cycle. The feedback signal from the secondary side is used

to modify the average on-time so the current through the

LEDs is properly regulated regardless of forward voltage

variation of the LED string.

Table 2. MAXIMUM RATINGS

Rating

Symbol

Value

Unit

MFP Voltage

VMFP

−0.3 to 10

V

MFP Current

IMFP

10

mA

COMP Voltage

VControl

−0.3 to 6.5

V

COMP Current

IControl

−2 to 10

mA

Ct Voltage

VCt

−0.3 to 6

V

Ct Current

ICt

10

mA

CS Voltage

VCS

−0.3 to 6

V

CS Current

ICS

10

mA

ZCD Voltage

VZCD

−0.3 to 10

V

ZCD Current

IZCD

10

mA

DRV Voltage

VDRV

−0.3 to VCC

V

DRV Sink Current

IDRV(sink)

800

mA

DRV Source Current

IDRV(source)

500

mA

Supply Voltage

VCC

−0.3 to 20

V

Supply Current

Power Dissipation (TA = 70C, 2.0 Oz Cu, 55 mm2 Printed Circuit Copper Clad)

ICC

20

mA

PD

450

mW

Thermal Resistance Junction-to-Ambient

(2.0 Oz Cu, 55 mm2 Printed Circuit Copper Clad)

Junction-to-Air, Low conductivity PCB (Note 3)

Junction-to-Air, High conductivity PCB (Note 4)

C/W

RqJA

178

RqJA

168

RqJA

127

Operating Junction Temperature Range

TJ

−40 to 125

C

Maximum Junction Temperature

TJ(MAX)

150

C

Storage Temperature Range

TSTG

−65 to 150

C

Lead Temperature (Soldering, 10 s)

TL

300

C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. This device series contains ESD protection and exceeds the following tests:

Pins 1–8: Human Body Model 2000 V per JEDEC Standard JESD22−A114E.

Pins 1– 8:Machine Model Method 200 V per JEDEC Standard JESD22−A115−A.

2. This device contains Latch-up protection and exceeds 100 mA per JEDEC Standard JESD78.

3. As mounted on a 40  40  1.5 mm FR4 substrate with a single layer of 80 mm2 of 2 oz copper traces and heat spreading area. As specified

for a JEDEC 51 low conductivity test PCB. Test conditions were under natural convection or zero air flow.

4. As mounted on a 40  40  1.5 mm FR4 substrate with a single layer of 650 mm2 of 2 oz copper traces and heat spreading area. As specified

for a JEDEC 51 high conductivity test PCB. Test conditions were under natural convection or zero air flow.

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