39SF512 データシートの表示（PDF） - Silicon Storage Technology
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39SF512 Datasheet PDF : 22 Pages
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512 Kbit Multi-Purpose Flash
SST39SF512
Data Sheet
TABLE 4: SOFTWARE COMMAND SEQUENCE
Command
Sequence
Byte-Program
Sector-Erase
Chip-Erase
Software ID Entry4,5
Software ID Exit6
Software ID Exit6
1st Bus
Write Cycle
Addr1 Data
5555H AAH
5555H AAH
5555H AAH
5555H AAH
XXH F0H
5555H AAH
2nd Bus
Write Cycle
Addr1 Data
2AAAH 55H
2AAAH 55H
2AAAH 55H
2AAAH 55H
2AAAH 55H
3rd Bus
Write Cycle
Addr1 Data
5555H A0H
5555H 80H
5555H 80H
5555H 90H
5555H F0H
4th Bus
Write Cycle
Addr1 Data
BA2 Data
5555H AAH
5555H AAH
5th Bus
Write Cycle
Addr1 Data
2AAAH 55H
2AAAH 55H
1. Address format A14-A0 (Hex), Address A15 can be VIL or VIH, but no other value, for the Command sequence.
2. BA = Program Byte address
3. SAX for Sector-Erase; uses AMS-A12 address lines
AMS = Most significant address
AMS = A15 for SST39SF512
4. The device does not remain in Software Product ID mode if powered down.
5. With AMS-A1 = 0; SST Manufacturer’s ID = BFH, is read with A0 = 0,
SST39SF512 Device ID = B4H, is read with A0 = 1
6. Both Software ID Exit operations are equivalent
6th Bus
Write Cycle
Addr1 Data
SAX3 30H
5555H 10H
T4.3 1149
Absolute Maximum Stress Ratings (Applied conditions greater than those listed under “Absolute Maximum
Stress Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation
of the device at these conditions or conditions greater than those defined in the operational sections of this data
sheet is not implied. Exposure to absolute maximum stress rating conditions may affect device reliability.)
Temperature Under Bias . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55°C to +125°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65°C to +150°C
D. C. Voltage on Any Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to VDD+0.5V
Transient Voltage (<20 ns) on Any Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -2.0V to VDD+2.0V
Voltage on A9 Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 14.0V
Package Power Dissipation Capability (Ta = 25°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0W
Through Hold Lead Soldering Temperature (10 Seconds) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C
Surface Mount Lead Soldering Temperature (3 Seconds) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 240°C
Output Short Circuit Current1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA
1. Outputs shorted for no more than one second. No more than one output shorted at a time.
OPERATING RANGE
Range
Commercial
Industrial
Ambient Temp
0°C to +70°C
-40°C to +85°C
VDD
4.5-5.5V
4.5-5.5V
AC CONDITIONS OF TEST
Input Rise/Fall Time . . . . . . . . . . . . . . 10 ns
Output Load . . . . . . . . . . . . . . . . . . . . . CL = 30 pF for 70 ns
Output Load . . . . . . . . . . . . . . . . . . . . . CL = 100 pF for 90 ns
See Figures 13 and 14
©2003 Silicon Storage Technology, Inc.
7
S71149-05-000
11/03
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