UCLAMP3301H.TCT(2004) データシートの表示（PDF） - Semtech Corporation
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UCLAMP3301H.TCT Datasheet PDF : 6 Pages
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PROTECTION PRODUCTS
Applications Information
Device Connection Options
The µclamp3301H is designed to protect one I/O, or
power supply line. It will present a high impedance to
the protected line up to 3.3 volts. It will “turn on”
when the line voltage exceeds 3.5 volts. The device is
unidirectional and may be used on lines where the
signal polarity is above ground. The cathode band
should be placed towards the line that is to be
protected.
EPD TVS Characteristics
These devices are constructed using Semtech’s
proprietary EPD technology. The structure of the EPD
TVS is vastly different from the traditional pn-junction
devices. At voltages below 5V, high leakage current
and junction capacitance render conventional ava-
lanche technology impractical for most applications.
However, by utilizing the EPD technology, these devices
can effectively operate at 3.3V while maintaining
excellent electrical characteristics.
The EPD TVS employs a complex nppn structure in
contrast to the pn structure normally found in tradi-
tional silicon-avalanche TVS diodes. The EPD mecha-
nism is achieved by engineering the center region of
the device such that the reverse biased junction does
not avalanche, but will “punch-through” to a conduct-
ing state. This structure results in a device with supe-
rior DC electrical parameters at low voltages while
maintaining the capability to absorb high transient
currents.
Matte Tin Lead Finish
Matte tin has become the industry standard lead-free
replacement for SnPb lead finishes. A matte tin finish
is composed of 100% tin solder with large grains.
Since the solder volume on the leads is small com-
pared to the solder paste volume that is placed on the
land pattern of the PCB, the reflow profile will be
determined by the requirements of the solder paste.
Therefore, these devices are compatible with both
lead-free and SnPb assembly techniques. In addition,
unlike other lead-free compositions, matte tin does not
have any added alloys that can cause degradation of
the solder joint.
uClamp3301H
Device Schematic & Pin Configuration
EPD TVS IV Characteristic Curve
IPP
ISB
IPT
VF
IR
IF
VRWM VSB VPT VC
2004 Semtech Corp.
4
www.semtech.com
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