STPS1L60AFN データシートの表示（PDF） - STMicroelectronics
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STPS1L60AFN Datasheet PDF : 10 Pages
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Characteristics
STPS1L60
Figure 17. Thermal resistance junction to
ambient versus copper surface
under each lead (SMA)
140 Rth(j-a)(°C/W)
Epoxy printed circuit board FR4
120
copper thickness = 35 µm
100
SMA
80
60
40
20
Scu(cm²)
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Figure 18. Thermal resistance versus lead
length (DO-41)
120 Rth(°C/W)
100
80
60
40
20
0
5
10
Rth(j-a)
Rth(j-l)
15
DO-41
Lleads(mm)
20
25
Figure 19. Thermal resistance junction to ambient versus copper surface under tab (STmite flat)
250 Rth(j-a)(°C/W)
225
Epoxy printed circuit board FR4
copper thickness = 35 µm
200
175
150
125
100
75
50
25
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5
STmite flat
Scu(cm²)
4.0 4.5 5.0
6/10
Doc ID 7504 Rev 8
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