SSD1881T1R1 データシートの表示（PDF） - Solomon Systech
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SSD1881T1R1 Datasheet PDF : 34 Pages
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5. SSD1881Z DIE PAD ASSIGNMENT
COM23
COM24
COM25
COM26
COM27
COM28
COM29
COM30
COM31
COM32
COM33
COM34
COM35
COM36
COM37
COM38
COM39
COM40
COM41
COM42
COM43
COM44
COM45
COM46
COM47
COM48
COM49
COM50
COM51
COM52
COM53
COM54
COM55
COM56
COM57
COM58
COM59
COM60
COM61
COM62
COM63
COM64
COM65
COM66
COM67
COM68
COM69
COM70
COM71
COM72
COM73
COM74
COM75
COM76
COM77
COM78
COM79
COM80
COM81
COM82
COM83
COM84
COM85
COM86
COM87
COM88
COM89
COM90
COM91
COM92
COM93
COM94
COM95
COM96
COM97
COM98
COM99
COM100
COM101
COM102
COM103
COM104
COM105
COM106
COM107
COM108
COM109
COM110
COM111
COM112
COM113
COM114
COM115
COM116
COM117
COM118
COM119
COM120
COM121
COM122
COM123
COM124
COM125
COM126
COM127
COM128
COM129
COM130
COM131
COM132
COM133
COM134
COM135
COM136
COM137
COM22
COM21
COM20
COM19
COM18
COM17
COM16
COM15
COM14
COM13
COM12
COM11
COM10
COM9
COM8
COM7
COM6
COM5
COM4
COM3
COM2
COM1
COM0
NC29
NC28
NC27
+V1
+V1
+V1
VC
VC
VC
-V1
-V1
-V1
NC26
NC25
NC24
NC23
NC22
NC21
NC20
NC19
NC18
NC17
NC16
TEST2
TEST1
F2
F2
F1
F1
YD
YD
CIO1
CIO1
CIO2
CIO2
LP
LP
CSEL
FR
DOFF#
LSEL
VDD_ROW
VDD_ROW
VDD_ROW
SEL
SHL
NC15
NC14
NC13
NC12
NC11
NC10
NC9
NC8
NC7
NC6
NC5
NC4
NC3
NC2
-V1
-V1
-V1
VC
VC
VC
+V1
+V1
+V1
NC1
COM159
COM158
COM157
COM156
COM155
COM154
COM153
COM152
COM151
COM150
COM149
COM178
COM147
COM146
COM145
COM144
COM143
COM142
COM141
COM140
COM139
COM138
Gold Bump Alignment Mark
This alignment mark contains gold bump for
IC bumping process alignment and IC
identifications. No conductive tracks should
be laid underneath this mark to avoid short
circuit.
Die Size: 12233.7um X 1356.1um
Bump Size: 60.2um X 60.2um
Die Thickness: 533um
Y
X
SSD1881
Pad 1,2,3.......116
Pad #1
Figure 2 – SSD1881Z Die Pad Assignment
SSD1881
3
Rev 2.1
09/2002
SOLOMON
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