AM29F800BB-150 データシートの表示（PDF） - Advanced Micro Devices

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AM29F800BB-150

8 Megabit (1 M x 8-Bit/512 K x 16-Bit) CMOS 5.0 Volt-only, Boot Sector Flash Memory

Advanced Micro Devices 

SUPPLEMENT

PHYSICAL SPECIFICATIONS

Die dimensions . . . . . . . . . 141.34 mils x 306.30 mils

. . . . . . . . . . . . . . . . . . . . . . . . . . . 3.59 mm x 7.78 mm

Die Thickness. . . . . . . . . . . . . . . . . . . . . . . . . ~20 mils

Bond Pad Size . . . . . . . . . . . . . . 3.94 mils x 3.94 mils

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 µm x 100 µm

Pad Area Free of Passivation . . . . . . . . . .15.52 mils2

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10,000 µm2

Pads Per Die . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .44

Bond Pad Metalization . . . . . . . . . . . . . . . . . . Al/Cu/Si

Die Backside . . . . . . . . . . . . . . . . . . . . . . . . No metal,

may be grounded (optional)

Passivation . . . . . . . . . . . . . . . . . . Nitride/SOG/Nitride

DC OPERATING CONDITIONS

VCC (Supply Voltage) . . . . . . . . . . . . . . . 4.5 V to 5.5 V

Junction Temperature Under Bias . .TJ (max) = 130°C

Operating Temperature

Commercial . . . . . . . . . . . . . . . . . . . 0°C to +70°C

Industrial . . . . . . . . . . . . . . . . . . . –40°C to +85°C

Extended . . . . . . . . . . . . . . . . . . –55°C to +125°C

MANUFACTURING INFORMATION

Manufacturing . . . . . . . . . . . . . . . . . . . . . . . . . . FASL

Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SDC

Manufacturing ID (Top Boot) . . . . . . . . . . . . 98924AK

(Bottom Boot) . . . . . . . .98924ABK

Preparation for Shipment . . . . . . . . Penang, Malaysia

Fabrication Process . . . . . . . . . . . . . . . . . . . . . . CS39

Die Revision . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

SPECIAL HANDLING INSTRUCTIONS

Processing

Do not expose KGD products to ultraviolet light or

process them at temperatures greater than 250°C.

Failure to adhere to these handling instructions will

result in irreparable damage to the devices. For best

yield, AMD recommends assembly in a Class 10K

clean room with 30% to 60% relative humidity.

Storage

Store at a maximum temperature of 30°C in a nitrogen-

purged cabinet or vacuum-sealed bag. Observe all

standard ESD handling procedures.

5/4/98

Am29F800B Known Good Die

7

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