MC74LCX374DW データシートの表示（PDF） - ON Semiconductor
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MC74LCX374DW Datasheet PDF : 8 Pages
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MC74LCX374
OUTLINE DIMENSIONS
DW SUFFIX
PLASTIC SOIC PACKAGE
CASE 751D–04
ISSUE E
D
A
q
20
11
E
1
10
20X B
B
0.25 M T A S B S
18X e
A
SEATING
PLANE
A1 T
C
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION SHALL
BE 0.13 TOTAL IN EXCESS OF B DIMENSION AT
MAXIMUM MATERIAL CONDITION.
MILLIMETERS
DIM MIN MAX
A 2.35 2.65
A1 0.10 0.25
B 0.35 0.49
C 0.23 0.32
D 12.65 12.95
E 7.40 7.60
e
1.27 BSC
H 10.05 10.55
h 0.25 0.75
L 0.50 0.90
q
0_ 7_
20
1
Z
D
e
b
0.13 (0.005) M
M SUFFIX
PLASTIC SOIC EIAJ PACKAGE
CASE 967–01
ISSUE O
11
E HE
10
A
LE
Q1
M_
L
DETAIL P
VIEW P
c
A1
0.10 (0.004)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
MILLIMETERS
DIM MIN MAX
A
--- 2.05
A1 0.05 0.20
b 0.35 0.50
c 0.18 0.27
D 12.35 12.80
E 5.10 5.45
e
1.27 BSC
HE 7.40 8.20
L 0.50 0.85
LE 1.10 1.50
M
0 _ 10 _
Q1 0.70 0.90
Z
--- 0.81
INCHES
MIN MAX
--- 0.081
0.002 0.008
0.014 0.020
0.007 0.011
0.486 0.504
0.201 0.215
0.050 BSC
0.291 0.323
0.020 0.033
0.043 0.059
0 _ 10 _
0.028 0.035
--- 0.032
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