NXP Semiconductors
BTA208X-1000C
High commutation three-quadrant triacs
5. Thermal characteristics
Table 5.
Symbol
Rth(j-h)
Rth(j-a)
Thermal characteristics
Parameter
Conditions
thermal resistance from full cycle or half cycle with heatsink
junction to heatsink compound; see Figure 6
full cycle or half cycle without heatsink
compound; see Figure 6
thermal resistance from
junction to ambient
Min Typ Max Unit
-
-
4.5 K/W
-
-
6.5 K/W
-
55
-
K/W
10
Zth(j-h)
(K/W)
1
(1)
(2)
(3)
(4)
003aaa972
10−1
P
10−2
10−5
10−4
10−3
10−2
10−1
tp
t
1
10
tp (s)
Fig 6. Transient thermal impedance from junction to heatsink as a function of pulse width
6. Isolation characteristics
Table 6.
Symbol
Visol(RMS)
Cisol
Isolation characteristics
Parameter
Conditions
RMS isolation voltage
isolation capacitance
from all terminals to external heatsink;
sinusoidal waveform; clean and dust free;
50 Hz ≤ f ≤ 60 Hz; RH ≤ 65 %; Th = 25 °C
from main terminal 2 to external heatsink;
f = 1 MHz; Th = 25 °C
Min Typ Max Unit
-
-
2500 V
-
10
-
pF
BTA208X-1000C_2
Product data sheet
Rev. 02 — 4 September 2009
© NXP B.V. 2009. All rights reserved.
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