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ICS621MILF(2010) データシートの表示(PDF) - Integrated Device Technology

部品番号
コンポーネント説明
メーカー
ICS621MILF
(Rev.:2010)
IDT
Integrated Device Technology IDT
ICS621MILF Datasheet PDF : 10 Pages
1 2 3 4 5 6 7 8 9 10
ICS621
LOW SKEW 1 TO 4 CLOCK BUFFER
FAN OUT BUFFER
AC Electrical Characteristics
VDD = 1.2 V ±5%, Ambient Temperature -40 to +85° C or 0 to +70° C, unless stated otherwise
Parameter
Symbol
Conditions
Min. Typ. Max. Units
Input Frequency
0
100 MHz
Output Rise Time
Output Fall Time
Propagation Delay
tOR
tOF
Note 1
20% to 80%, Note 3
80% to 20%, Note 3
1.0 1.5 ns
1.0 1.5 ns
2.2
3
5
ns
Output to Output Skew
Note 2 Rising edges at VDD/2
0 ±150 ps
VDD = 1.5 V ±5%, Ambient Temperature -40 to +85° C or 0 to +70° C, unless stated otherwise
Parameter
Symbol
Conditions
Min. Typ. Max. Units
Input Frequency
0
166 MHz
Output Rise Time
Output Fall Time
Propagation Delay
tOR
tOF
Note 1
20% to 80%, Note 3
80% to 20%, Note 3
1.0 1.5 ns
1.0 1.5 ns
2.2
3
5
ns
Output to Output Skew
Note 2 Rising edges at VDD/2
0 ±150 ps
VDD = 1.8 V ±5%, Ambient Temperature -40 to +85° C or 0 to +70° C, unless stated otherwise
Parameter
Symbol
Conditions
Min. Typ. Max. Units
Input Frequency
0
200 MHz
Output Rise Time
Output Fall Time
Propagation Delay
tOR
tOF
Note 1
20% to 80%, Note 3
80% to 20%, Note 3
1.0 1.5 ns
1.0 1.5 ns
2.2
3
5
ns
Output to Output Skew
Note 2 Rising edges at VDD/2
0 ±150 ps
Notes: 1. With rail to rail input clock
2. Between any 2 outputs with equal loading.
3. Measured with a 15 pF load.
Thermal Characteristics
Parameter
Symbol Conditions
Thermal Resistance Junction to
Ambient
θJA Still air
θJA 1 m/s air flow
θJA 3 m/s air flow
Thermal Resistance Junction to Case θJC
Case Temperature
Thermal Resistance Junction to Top
of Case
ΨJT Still air
Min.
Typ.
150
140
120
40
20
Max. Units
° C/W
° C/W
° C/W
° C/W
120 ° C
° C/W
IDT® LOW SKEW 1 TO 4 CLOCK BUFFER
5
ICS621
REV G 051310

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