LM75B(2008) データシートの表示（PDF） - NXP Semiconductors.
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LM75B Datasheet PDF : 37 Pages
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NXP Semiconductors
LM75B
Digital temperature sensor and thermal watchdog
4. Ordering information
Table 1. Ordering information
Type
number
Topside Package
mark
Name Description
LM75BD
LM75BD SO8
plastic small outline package; 8 leads; body width 3.9 mm
LM75BDP LM75B TSSOP8 plastic thin shrink small outline package; 8 leads; body width 3 mm
LM75BGD[1] 75B
XSON8U plastic extremely thin small outline package; no leads; 8 terminals;
UTLP based; body 3 2 0.5 mm
LM75BTP M75
HWSON8 plastic thermal enhanced very very thin small outline package;
no leads; 8 terminals, 2 3 0.8 mm
Version
SOT96-1
SOT505-1
SOT996-2
SOT1069-2
[1] LM75BGD cannot be production cold temperature tested because of manufacturing process constraints. Although no LM75BGD
complaints have been noted, NXP recommends consideration/use of the LM75BTP instead of the LM75BGD in operating environments
of less than 0 C.
4.1 Ordering options
Table 2. Ordering options
Type number Orderable
part number
Package Packing method
LM75BD
LM75BDP
LM75BGD
LM75BTP
LM75BD,112
LM75BD,118
LM75BDP,118
LM75BGD,125
LM75BTP,147
SO8
SO8
TSSOP8
XSON8U
HWSON8
Standard marking * IC’s tube -
DSC bulk pack
Reel 13” Q1/T1
*Standard mark SMD
Reel 13” Q1/T1
*Standard mark SMD
Reel 7” Q3/T4 *Standard mark
Reel 7” Q2/T3 *Standard mark
Minimum
order
quantity
2000
Temperature
Tamb = 55 C to +125 C
2500
Tamb = 55 C to +125 C
2500
Tamb = 55 C to +125 C
3000
4000
Tamb = 55 C to +125 C
Tamb = 55 C to +125 C
LM75B
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6.1 — 6 February 2015
© NXP B.V. 2015. All rights reserved.
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