62/'(5,1* ,1)250$7,21
Resistance to Soldering Heat
Maximum Reflow Temperature
Maximum Number of Reflow Cycles
Seating Plane Co-planarity
Lead Finish
DA9251.001
25 October, 2001
According to RSH test IEC 68-2-58/20 2*220°C
235°C
2
max 0.08 mm
Solder plate 7.62 - 25.4 µm, material Sn 85% Pb 15%
(0%266(' 7$3( 63(&,),&$7,216
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