MAX14802ECM データシートの表示（PDF） - Maxim Integrated
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MAX14802ECM Datasheet PDF : 20 Pages
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MAX14802/MAX14803/MAX14803A
Low-Charge Injection, 16-Channel,
High-Voltage Analog Switches
ABSOLUTE MAXIMUM RATINGS
(All voltages referenced to GND.)
VDD Logic-Supply Voltage .......................................-0.3V to +7V
VPP - VNN Supply Voltage
(MAX14802CCM+, MAX14803CCM+)..............................260V
(MAX14802ECM+, MAX14803AEWZ+) ............................230V
VPP Positive-Supply Voltage.................................-0.3V to +220V
VNN Negative-Supply Voltage ...............................-0.3V to -220V
Logic Inputs (LE, CLR, CLK, DIN, DOUT)................-0.3V to +7V
COM_, NO_...............................(-0.3V + VNN) to the minimum of
[(VNN + 220V) or (VPP + 0.3V)]
Peak Analog Signal Current Per Channel ................................3A
Continuous Power Dissipation (TA = +70°C)
48-Pin TQFP (derate 22.7mW/°C above +70°C).........1818mW
110-Bump WLP (derate 37mW°C above +70°C)........2960mW
Operating Temperature Range (Commercial) ........0°C to +70°C
Operating Temperature Range (Extended).........-40°C to +85°C
Storage Temperature Range .............................-65°C to +150°C
Junction Temperature ..................................................... +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TQFP
Junction-to-Ambient Thermal Reistance (θJA)..............44°C/W
Junction-to-Case Thermal Resistance (θJC).................10°C/W
WLP
Junction-to-Ambient Thermal Reistance (θJA)..............27°C/W
Junction-to-Case Thermal Resistance (θJC)...................1°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(VDD = +2.7V to +5.5V, VPP = +40V to VNN + 250V, VNN = -40V to -160V, TA = TMIN to TMAX, unless otherwise noted. Typical values
are at TA = +25°C.) (Note 2)
PARAMETER
POWER SUPPLIES
VDD Supply Voltage
VPP Supply Voltage
VNN Supply Voltage
VDD Supply Quiescent
Current
SYMBOL
CONDITIONS
VDD
VPP
VNN
IDDQ
MAX14802ECM+, MAX14803AEWZ+
MAX14802CCM+, MAX14803CCM+
MIN
TYP
MAX UNITS
+2.7
+5.5
V
+40
+100
VNN +
200
V
+40
+100
VNN +
250
-160
-100
0
V
5
μA
VDD Supply Dynamic
Current
IDD
VDD = +5V, VLE = +5V, fCLK = 5MHz
0.5
mA
VPP Supply Quiescent
Current
IPPQ
All switches remain on or off, ICOM_ = 5mA
0
10
μA
2
Maxim Integrated
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