MAX3940E データシートの表示（PDF） - Maxim Integrated

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MAX3940E

10Gbps EAM Driver with Integrated Bias Network

Maxim Integrated 

10Gbps EAM Driver with Integrated

Bias Network

RTEN

MODEN

PLRT

50Ω

50Ω

50Ω

ROUT

50Ω

50Ω

50Ω

OUT

CLK+

CLK-

VEE

ZL

DQ

0

POLARITY

DATA+

DATA-

MUX

PWC

1

50Ω

50Ω

MAX3940

IMOD

IBIAS

VEE

VEE

Figure 6. Functional Diagram

PWC+

PWC-

2kΩ

VEE

MODSET

+

VMODSET

-

BIASSET

+

VBIASSET

-

VEE

VEE

Interface Schematics

Figures 7 and 8 show simplified input and output cir-

cuits of the MAX3940 EAM driver.

Wire Bonding Die

For high-current density and reliable operation, the

MAX3940 uses gold metalization. Make connections to

the die with gold wire only, using ball-bonding techniques.

Minimize bond-wire lengths and ensure that the span

between the ends of the bond wire does not come clos-

er to the edge of the die than two times the bond-wire

diameter. The minimum length of the bond wires might

be constrained by the type of wire bonder used, as well

as the dimensions of the die.

To minimize inductance, keep the connections from

OUT, GND, and VEE as short as possible. This is crucial

for optimal performance.

Laser Safety and IEC 825

Using the MAX3940 EAM driver alone does not ensure

that a transmitter design is compliant with IEC 825. The

entire transmitter circuit and component selections must

be considered. Each customer must determine the level

of fault tolerance required by their application, recogniz-

ing that Maxim products are not designed or authorized

for use as components in systems intended for surgical

implant into the body, for applications intended to sup-

port or sustain life, or for any other application where the

failure of a Maxim product could create a situation where

personal injury or death may occur.

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