MAX5073 データシートの表示（PDF） - Maxim Integrated

部品番号

コンポーネント説明

メーカー

MAX5073

2.2MHz, Dual-Output Buck or Boost Converter with Internal Power MOSFETs

Maxim Integrated 

2.2MHz, Dual-Output Buck or Boost Converter

with Internal Power MOSFETs

ABSOLUTE MAXIMUM RATINGS

V+ to PGND............................................................-0.3V to +25V

SOURCE2, DRAIN2 Peak Current ..............................3A for 1ms

SGND to PGND .....................................................-0.3V to +0.3V

VL, BYPASS to SGND Short Circuit............................Continuous

VL to SGND...................-0.3V to the lower of +6V or (V+ + 0.3V)

Continuous Power Dissipation (TA = +70°C)

BST1/VDD1, BST2/VDD2, DRAIN_, PGOOD2, PGOOD1 to

28-Pin Thin QFN (derate 21.3mW/°C above +70°C).....2758mW*

SGND .................................................................-0.3V to +30V

Package Junction-to-Case Thermal Resistance (θJC).......2°C/W

BST1/VDD1 to SOURCE1,

Operating Temperature Ranges:

BST2/VDD2 to SOURCE2 ....................................-0.3V to +6V

MAX5073ETI (TMIN to TMAX)............................-40°C to +85°C

SOURCE_ to SGND................................................-0.6V to +25V

MAX5073ATI (TMIN to TMAX) .........................-40°C to +125°C

EN_ to SGND .............................................-0.3V to (VL to +0.3V)

Junction Temperature ......................................................+150°C

CLKOUT, BYPASS, OSC, COMP1,

Storage Temperature Range .............................-65°C to +150°C

COMP2, SYNC, FB_ to SGND ..................-0.3V to (VL + 0.3V)

Lead Temperature (soldering, 10s) .................................+300°C

SOURCE1, DRAIN1 Peak Current ..............................5A for 1ms

*As per JEDEC51 standard.

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

ELECTRICAL CHARACTERISTICS

(V+ = VL = 5.2V or V+ = 5.5V to 23V, EN_ = VL, SYNC = GND, IVL = 0mA, PGND = SGND, CBYPASS = 0.22µF, CVL = 4.7µF (ceram-

ic), ROSC = 10kΩ (circuit of Figure 1), TA = TJ = TMIN to TMAX, unless otherwise noted.) (Note 1)

PARAMETER

SYSTEM SPECIFICATIONS

Input Voltage Range

SYMBOL

(Note 2)

V+

VL = V+

CONDITIONS

MIN TYP MAX UNITS

5.5

23.0

V

4.5

5.5

Operating Supply Current

IQ

VL unloaded, no switching, VFB_ = 1V, V+ =

12V, ROSC = 60kΩ

2.2

4

mA

V+ Standby Supply Current

Efficiency

STARTUP/VL REGULATOR

VL Undervoltage Lockout Trip

Level

VL Undervoltage Lockout

Hysteresis

VL Output Voltage

BYPASS OUTPUT

BYPASS Voltage

BYPASS Load Regulation

SOFT-START

Digital Ramp Period

Soft-Start Steps

ISTBY

η

EN_ = 0, PGOOD_ floating, V+ = 12V,

ROSC = 60kΩ (MAX5073ETI)

EN_ = 0, PGOOD_ floating, V+ = 12V,

ROSC = 60kΩ (MAX5073ATI)

VOUT1 = 3.3V at 1.5A,

VOUT2 = 2.5V at 0.75A

(fSW = 1.25MHz)

V+ = VL = 5V

V+ = 12V

V+ = 16V

0.6

1.2

mA

0.6

1.4

82

80

%

78

UVLO VL falling

3.95

4.1

4.25

V

VL

V+ = 5.5V to 23V, ISOURCE = 0 to 40mA

175

mV

4.9

5.2

5.5

V

VBYPASS

IBYPASS = 0, ROSC = 60kΩ (MAX5073ETI)

IBYPASS = 0, ROSC = 60kΩ (MAX5073ATI)

1.98

1.975

2.00

2.00

2.02

2.025

V

∆VBYPASS 0 ≤ IBYPASS ≤ 50µA, ROSC = 60kΩ

0

2

10

mV

Internal 6-bit DAC

2048

64

fOSC

clock

cycles

steps

2 _______________________________________________________________________________________

Share Link: