MC14174BF データシートの表示（PDF） - ON Semiconductor
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MC14174BF Datasheet PDF : 8 Pages
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MC14174B
Hex Type D Flip-Flop
The MC14174B hex type D flip–flop is constructed with MOS
P–channel and N–channel enhancement mode devices in a single
monolithic structure. Data on the D inputs which meets the setup time
requirements is transferred to the Q outputs on the positive edge of the
clock pulse. All six flip–flops share common clock and reset inputs.
The reset is active low, and independent of the clock.
• Static Operation
• All Inputs and Outputs Buffered
• Diode Protection on All Inputs
• Supply Voltage Range = 3.0 Vdc to 18 Vdc
• Capable of Driving Two Low–Power TTL Loads or One Low–Power
Schottky TTL Load over the Rated Temperature Range
• Functional Equivalent to TTL 74174
MAXIMUM RATINGS (Voltages Referenced to VSS) (Note 2.)
Symbol
Parameter
Value
Unit
VDD
DC Supply Voltage Range
–0.5 to +18.0
V
Vin, Vout Input or Output Voltage Range –0.5 to VDD + 0.5
V
(DC or Transient)
Iin, Iout
Input or Output Current
(DC or Transient) per Pin
±10
mA
PD
Power Dissipation,
per Package (Note 3.)
500
mW
TA
Ambient Temperature Range
Tstg
Storage Temperature Range
TL
Lead Temperature
(8–Second Soldering)
–55 to +125
°C
–65 to +150
°C
260
°C
2. Maximum Ratings are those values beyond which damage to the device
may occur.
3. Temperature Derating:
Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C To 125_C
This device contains protection circuitry to guard against damage due to high
static voltages or electric fields. However, precautions must be taken to avoid
applications of any voltage higher than maximum rated voltages to this
high–impedance circuit. For proper operation, Vin and Vout should be constrained
to the range VSS v (Vin or Vout) v VDD.
Unused inputs must always be tied to an appropriate logic voltage level (e.g.,
either VSS or VDD). Unused outputs must be left open.
http://onsemi.com
PDIP–16
P SUFFIX
CASE 648
MARKING
DIAGRAMS
16
MC14174BCP
AWLYYWW
1
SOIC–16
D SUFFIX
CASE 751B
16
14174B
AWLYWW
1
SOEIAJ–16
F SUFFIX
CASE 966
16
MC14174B
ALYW
1
A
WL, L
YY, Y
WW, W
= Assembly Location
= Wafer Lot
= Year
= Work Week
ORDERING INFORMATION
Device
Package
Shipping
MC14174BCP
PDIP–16
2000/Box
MC14174BD
SOIC–16
48/Rail
MC14174BDR2 SOIC–16 2500/Tape & Reel
MC14174BF
SOEIAJ–16 See Note 1.
MC14174BFEL SOEIAJ–16 See Note 1.
1. For ordering information on the EIAJ version of
the SOIC packages, please contact your local
ON Semiconductor representative.
© Semiconductor Components Industries, LLC, 2000
1
August, 2000 – Rev. 4
Publication Order Number:
MC14174B/D
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