MC33186 データシートの表示（PDF） - Motorola => Freescale

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MC33186

Automotive H-Bridge Driver

Motorola => Freescale 

MC33186

FreescalPeACSKAeGmE INiFcOoRnMAdTuIOcN tor, Inc.

The HSOP20 package is designed for enhanced thermal

performance. The particularity of this package is its copper

baseplate on which the power die is soldered. The baseplate

is soldered on a PCB to provide heat flow to the ambient and

also to provide a large thermal capacitance.

Of course, the more copper area on the PCB, the better

the power dissipation and transient behaviour.

We characterized the HSOP20 on a double side PCB. The

bottom side area of the copper is 7.8 cm2. The top surface is

2.7 cm2, see Figure 22.

Figure 22. PCB Test Layout

Figure 23. PHSOP20 Thermal Response

100

10

Rth (°C/W)

1

0,1

0,001

0,01

0,1

1

10

t, Time (s)

100

1000

10000

Figure 23 shows the thermal response with the device

soldered on to the test PCB described on figure 22.

Top Side

Bottom Side

For More Information On This Product,

MC33186

Go to: MwOwTwOR.fOreLeAscale.com

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