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MPX4200A(2002) データシートの表示(PDF) - Freescale Semiconductor

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MPX4200A Datasheet PDF : 8 Pages
1 2 3 4 5 6 7 8
Freescale Semiconductor, Inc.
MPX4200A SERIES
SILICONE
DIE COAT
ÉÉÉÉÉÉÉÉÉÉÉÉ WIRE BOND
DIE
P1
STAINLESS STEEL
METAL COVER
EPOXY
CASE
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ LEAD FRAME
RTV DIE
P2
BOND
1.0 mF
0.01 mF
+5 V
Vout
Vs
IPS
GND
OUTPUT
470 pF
SEALED VACUUM REFERENCE
Figure 2. Cross–Sectional Diagram
(Not to Scale)
Figure 3. Recommended power supply decoupling
and output filtering.
For additional output filtering, please refer to
Application Note AN1646.
Figure 2 illustrates the absolute sensing chip in the basic
chip carrier (Case 867). A fluorosilicone gel isolates the
die surface and wire bonds from the environment, while
allowing the pressure signal to be transmitted to the sen-
sor diaphragm. The MPX4200A series pressure sensor
operating characteristics, and internal reliability and quali-
fication tests are based on use of dry air as the pressure
media. Media, other than dry air, may have adverse ef-
fects on sensor performance and long–term reliability.
Contact the factory for information regarding media com-
patibility in your application.
Figure 3 shows the recommended decoupling circuit for
interfacing the output of the integrated sensor to the A/D in-
put of a microprocessor or microcontroller. Proper decoup-
ling of the power supply is recommended.
Figure 4 shows the sensor output signal relative to pres-
sure input. Typical minimum and maximum output curves
are shown for operation over temperature range of 0° to
85°C. The output will saturate outside of the specified pres-
sure range.
5.0
4.5 TRANSFER FUNCTION:
MAX
4.0 Vout = VS* (0.005 x P-0.04) ± Error
VS = 5.1 Vdc
3.5 TEMP = 0 to 85°C
TYP
3.0
2.5
2.0
1.5
MIN
1.0
0.5
0
Figure 4. Output versus Absolute Pressure
Motorola Sensor Device Data For More Information On This Product,
3
Go to: www.freescale.com

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