DatasheetQ Logo
Electronic component search and free download site. Transistors,MosFET ,Diode,Integrated circuits

MT47H128 データシートの表示(PDF) - Micron Technology

部品番号
コンポーネント説明
メーカー
MT47H128
Micron
Micron Technology Micron
MT47H128 Datasheet PDF : 133 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
DDR2 SDRAM
MT47H256M4 – 32 Meg x 4 x 8 banks
MT47H128M8 – 16 Meg x 8 x 8 banks
MT47H64M16 – 8 Meg x 16 x 8 banks
1Gb: x4, x8, x16 DDR2 SDRAM
Features
Features
• VDD = 1.8V ±0.1V, VDDQ = 1.8V ±0.1V
• JEDEC-standard 1.8V I/O (SSTL_18-compatible)
• Differential data strobe (DQS, DQS#) option
• 4n-bit prefetch architecture
• Duplicate output strobe (RDQS) option for x8
• DLL to align DQ and DQS transitions with CK
• 8 internal banks for concurrent operation
• Programmable CAS latency (CL)
• Posted CAS additive latency (AL)
• WRITE latency = READ latency - 1 tCK
• Selectable burst lengths (BL): 4 or 8
• Adjustable data-output drive strength
• 64ms, 8192-cycle refresh
• On-die termination (ODT)
• Industrial temperature (IT) option
• Automotive temperature (AT) option
• RoHS-compliant
• Supports JEDEC clock jitter specification
Options1
• Configuration
– 256 Meg x 4 (32 Meg x 4 x 8 banks)
– 128 Meg x 8 (16 Meg x 8 x 8 banks)
– 64 Meg x 16 (8 Meg x 16 x 8 banks)
• FBGA package (Pb-free) – x16
– 84-ball FBGA (8mm x 12.5mm) Die
Rev :H
– 84-ball FBGA (8mm x 12.5mm) Die
Rev :M
• FBGA package (Pb-free) – x4, x8
– 60-ball FBGA (8mm x 10mm) Die
Rev :H
– 60-ball FBGA (8mm x 10mm) Die
Rev :M
• FBGA package (lead solder) – x16
– 84-ball FBGA (8mm x 12.5mm) Die
Rev :H
• FBGA package (lead solder) – x4, x8
– 60-ball FBGA (8mm x 10mm) Die
Rev :H
• Timing – cycle time
– 1.875ns @ CL = 7 (DDR2-1066)
– 2.5ns @ CL = 5 (DDR2-800)
– 3.0ns @ CL = 5 (DDR2-667)
• Self refresh
– Standard
– Low-power
• Operating temperature
– Commercial (0°C TC +85°C)2
– Industrial (–40°C TC +95°C;
–40°C TA +85°C)
• Revision
Marking
256M4
128M8
64M16
HR
NF
CF
SH
HW
JN
-187E
-25E
-3
None
L
None
IT
:H / :M
Notes:
1. Not all options listed can be combined to
define an offered product. Use the Part
Catalog Search on www.micron.com for
product offerings and availability.
2. For extended CT operating temperature see
IDD Table 11 (page 30) Note 7.
PDF: 09005aef8565148a
1GbDDR2.pdf – Rev. AA 07/14 EN
1
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2007 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.

Share Link: 

datasheetq.com  [ Privacy Policy ]Request Datasheet ] [ Contact Us ]