MTN1308E3 データシートの表示（PDF） - Cystech Electonics Corp.
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MTN1308E3 Datasheet PDF : 6 Pages
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CYStech Electronics Corp.
TO-220 Dimension
Spec. No. : C440E3
Issued Date : 2009.02.23
Revised Date :
Page No. : 6/6
A
D
B
E
Marking:
C
H
I
3
G
2
1
4
P
Device Name
13N08
M
K
□□□□ Date Code
N
O
3-Lead TO-220 Plastic Package
CYStek Package Code: E3
Style: Pin 1.Gate 2.Drain 3.Source
4.Drain
*: Typical
DIM
Inches
Min. Max.
Millimeters
Min. Max.
DIM
Inches
Min. Max.
Millimeters
Min. Max.
A 0.2441 0.2598 6.20 6.60
I
- *0.1508 -
*3.83
B 0.3386 0.3543 8.60 9.00
K 0.0299 0.0394 0.76 1.00
C 0.1732 0.1890 4.40
4.80
M 0.0461 0.0579 1.17
1.47
D 0.0492 0.0571 1.25 1.45
N
- *0.1000 -
*2.54
E 0.0142 0.0197 0.36 0.50
O 0.5217 0.5610 13.25 14.25
G 0.3858 0.4094 9.80 10.40 P 0.5787 0.6024 14.70 15.30
H
- *0.6398 -
*16.25
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: KFC ; pure tin plated
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
MTN1308E3
CYStek Product Specification
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