SMP-75 Case
10-Terminal Ceramic Surface-Mount Case
19 x 6.5 mm Nominal Footprint
Dimension
A
B
C
D
E
H
P
Min
18.80
6.30
Case Dimensions
mm
Nom Max Min
19.00 19.30 0.740
6.50 6.80 0.248
1.75 2.00
2.29
1.02
1.0
1.905
Inches
Nom
0.748
0.256
0.069
0.090
0.040
0.039
0.075
Max
0.760
0.268
0.079
Electrical Connections
Connection
Terminals
Port 1 Hot
10
Ground Return
1
Port 2 Hot
5
Ground Return
6
Case Ground
All others
Single Ended Operation
Return is ground
Differential Operation
Return is hot
Solder Pad
Termination
Lid
Body
Pb Free
Materials
Au plating 30 - 60 µinches (76.2-152 µm) over 80-200
µinches (203-508 µm) Ni.
Fe-Ni-Co Alloy Electroless Nickel Plate (8-11% Phos-
phorus) 100-200 µinches Thick
Al2O3 Ceramic
B
C
D
H
6
5
7
4
A
8
3
9
2
10
1
P (8 Places)
5
6
4
7
3
8
2
9
E (10 Places)
1
10
TOP VIEW
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©2008 by RF Monolithics, Inc.
BOTTOM VIEW
Page 2 of 2
SF2069A-1 - 6/26/08