3003KRC80 データシートの表示（PDF） - Fairchild Semiconductor
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3003KRC80 Datasheet PDF : 12 Pages
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PRODUCT SPECIFICATION
TMC3003
Mechanical Dimensions – 48-Lead LQFP Package
Symbol
A
A1
A2
B
D/E
D1/E1
e
L
N
ND
α
ccc
Inches
Min. Max.
.055 .063
.001 .005
.053 .057
.006 .010
.346
.362
.268
.284
.019 BSC
.017 .029
48
12
0°
7°
.004
Millimeters
Min. Max.
1.40 1.60
.05
.15
1.35 1.45
.17
.27
8.8
9.2
6.8
7.2
.50 BSC
.45
.75
48
12
0°
7°
0.08
Notes
7
8
2
6
4
5
Notes:
1. All dimensions and tolerances conform to ANSI Y14.5M-1982.
2. Dimensions "D1" and "E1" do not include mold protrusion.
Allowable protrusion is 0.25mm per side. D1 and E1 are maximum
plastic body size dimensions including mold mismatch.
3. Pin 1 identifier is optional.
4. Dimension ND: Number of terminals.
5. Dimension ND: Number of terminals per package edge.
6. "L" is the length of terminal for soldering to a substrate.
7. Dimension "B" does not include dambar protrusion. Allowable
dambar protrusion shall not cause the lead width to exceed the
maximum B dimension by more than 0.08mm. Dambar can not be
located on the lower radius or the foot. Minimum space between
protrusion and an adjacent lead is 0.07mm for 0.4mm and 0.5mm
pitch packages.
8. To be determined at seating place —C—
D
D1
e
E E1
PIN 1
IDENTIFIER
L
0.063" Ref (1.60mm)
A
A2
B
A1
See Lead Detail
Base Plane
Seating Plane
-C-
LEAD COPLANARITY
ccc C
C
α
REV. 1.0.3 3/5/01
11
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