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TMP91C824F データシートの表示（PDF） - Toshiba

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TMP91C824F

Quality And Reliability Assurance / Handling Precautions

Toshiba

TMP91C824F Datasheet PDF : 48 Pages

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Quality and Reliability Assurance / Handling Precautions

Table 2.3 Storage conditions, permissible usage Period after unpacking and baking

requirements for each soldering method (2/2)

Products

Name

TMP95CW64F

TMP95CW65F

TMP95PW64F

TMP95FY64F

TMP95CS66F

TMP95CS54F

TMP95PS54F

TMP95CU54AF

TMP95CW54AF

TMP95FW54AF

TMP94C241CF

TMP94C251AF

TMP94FU81F

TMP91CW18AF

TMP91PW18AF

TMP91CW12F

TMP91PW12F

TMP91CW12AF

TMP91FY12AF

TMP91CY22F

TMP91FY22F

TMP91CU10F

TMP91PW10F

TMP91CW11F

TMP91PW11F

TMP91C219F

TMP91C829F

TMP91C815F

TMP91C016F

TMP91C025F

TMP91C824F

Package no.

P-LQFP100-1414-0.50D

P-QFP100-1414-0.50E

P-LQFP100-1414-0.50D

P-LQFP100-1414-0.50E

P-QFP160-2828-0.65A

P-QFP144-2020-0.50

P-LQFP100-1414-0.50C

P-QFP80-1420-0.80B

P-LQFP100-1414-0.50C

P-LQFP100-1414-0.50D

P-LQFP100-1414-0.50E

P-LQFP100-1414-0.50D

P-LQFP100-1414-0.50E

P-LQFP100-1414-0.50C

P-LQFP100-1414-0.50D

P-LQFP100-1414-0.50C

P-LQFP100-1414-0.50B

P-LQFP100-1414-0.50D

P-LQFP100-1414-0.50B

P-LQFP100-1414-0.50D

P-TQFP128-1414-0.40

P-LQFP100-1414-0.50D

Air reflow

A(168h)

B(72h)

A(168h)

Infrared reflow

A(168h)

B(72h)

A(168h)

Note 1: As of February, 2002

Note 2:

Symbols A (168h), B (72h), C (48h), D (24h), E (12h), G and  indicate

the maximum permissible period between unpacking and mounting of

the device, and the required storage conditions for the device. For

details of these conditions, please refer to Table 2.2.

030901

QUA-11

2002-02-20

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