White Electronic Designs WED3C755E8M-XBX
FIG. 5 - PIN ASSIGNMENTS
Ball assignments of the 255 CBGA package as viewed from the top surface.
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
Side profile of the CBGA package to indicate the direction of the top surface view.
Substrate Assembly
View
Underfill Encapsulant
Die
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
May, 2003
Rev 2
4
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com