Recommended Infrared Reflow Soldering Profile
Entrance
Zone 1
Zone 2
Zone 3
Zone 4
Zone 5 Cooling
270.00
236.25
202.50
168.75
135.00
101.25
67.50
33.75
0.00
0.66 1.31 1.97 2.63 3.28 3.94 4.60 5.26 5.91 6.57 7.23 7.88
Time (min.)
Reflow Profile for Pb Free
Average ramp-up rate (183°C to peak)
Preheat Temperature 125(±25)°C to 200°C
Temperature maintained above 220°C
Time within 5°C of actual peak temperature
Peak temperature range
Ramp down rate
Time 25°C to peak temperature
Convection Reflow
3°C/sec max
60-180°C
60-150 sec
20-40 sec
260 ±5°C
6°C/sec max
8min max
Note: Surface Mount Adhesives (SMA) isn’t recommended to be used on the dome area (white dome).
7
FODB100, FODB101, FODB102 Rev. 1.0.0
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