MAX9632 データシートの表示（PDF） - Maxim Integrated

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MAX9632

36V, Precision, Low-Noise, Wide-Band Amplifier

Maxim Integrated 

36V, Precision, Low-Noise,

Wide-Band Amplifier

ABSOLUTE MAXIMUM RATINGS

VCC to VEE.............................................................-0.3V to +40V

All Other Pins...................................(VEE - 0.3V) to (VCC + 0.3V)

Short-Circuit (GND) Duration, OUT........................................ 10s

Continuous Input Current (any pin).................................. Q20mA

Continuous Power Dissipation (TA = +70NC) (Note 1)

Multilayer SO (derate 7.4mW/NC above +70NC)..........588mW

Multilayer TDFN (derate 23.8mW/NC above +70NC)...1905mW

Multilayer µMAX (derate 4.8mW/NC above +70NC)...387.8mW

ESD Protection

HBM...............................................................................................8kV

CDM.................................................................................... 1kV

Operating Temperature Range......................... -40NC to +125NC

Junction Temperature......................................................+150NC

Lead Temperature (soldering, 10s).................................+300NC

Soldering Temperature (reflow).......................................+260NC

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

PACKAGE THERMAL CHARACTERISTICS (Note 1)

6 TDFN

8 µMAX

Junction-to-Ambient Thermal Resistance (qJA)...........42°C/W

Junction-to-Case Thermal Resistance (qJC)..................8°C/W

8 SO

Junction-to-Ambient Thermal Resistance (qJA).........136°C/W

Junction-to-Case Thermal Resistance (qJC)................38°C/W

Junction-to-Ambient Thermal Resistance (qJA)......206.3°C/W

Junction-to-Case Thermal Resistance (qJC)................42°C/W

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-

layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.

ELECTRICAL CHARACTERISTICS

(VCC = 15V, VEE = -15V, RL = 10kI to VGND, VIN+ = VIN- = VGND = 0V, VSHDN = VGND, TA = -40NC to +125NC. Typical values are

at TA = +25NC, unless otherwise noted.) (Note 2)

PARAMETER

SYMBOL

CONDITIONS

MIN TYP MAX UNITS

POWER SUPPLY

Supply Voltage Range

Supply Current

Power-Supply Rejection Ratio

SHUTDOWN

VCC

ICC

PSRR

Guaranteed by PSRR

TA = +25NC

-40NC P TA P +125NC

4.5

36

V

3.9

6.5

mA

125

140

dB

120

Shutdown Input Voltage

VSHDN

Device disabled

Device enabled

VCC

- 0.35

VEE

VCC

V

VCC

- 3.0

Shutdown Current

DC SPECIFICATIONS

ISHDN VSHDN = VCC

1

15

FA

Input Offset Voltage

Input Offset Voltage Drift

Input Bias Current

Input Offset Current

VOS

QDVOS

IB

IOS

TA = +25NC

-40NC P TA P +125NC

(Note 3)

30

125

FV

165

0.15

0.5 FV/NC

30

180

nA

15

100

nA

Input Common-Mode Range

VCM Guaranteed by CMRR

VEE +

1.8

VCC -

1.4

V

2  _______________________________________________________________________________________

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