MF1S5009 データシートの表示（PDF） - NXP Semiconductors.
部品番号
コンポーネント説明
メーカー
MF1S5009
NXP Semiconductors.
MF1S5009 Datasheet PDF : 32 Pages
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NXP Semiconductors
6. Pinning information
6.1 Smart card contactless module
MF1S5009
Mainstream contactless smart card IC
LA
top view
LB
Fig 3. Contact assignments for SOT500-2 (MOA4)
001aam200
Table 2. Bonding pad assignments to smart card contactless module
Contactless interface module
MF1S5009DA4
Antenna contacts Symbol
Description
LA
LA
Antenna coil connection LA
LB
LB
Antenna coil connection LB
7. Mechanical specification
Table 3. Specifications
Wafer
diameter
maximum diameter after foil expansion
thickness
flatness
Potential Good Dies per Wafer (PGDW)
Wafer backside
material
treatment
roughness
Chip dimensions
step size
200 mm typical (8 inches)
210 mm
120 μm ± 15 μm
not applicable
18482
Si
ground and stress relieve
Ra max = 0.2 μm
Rt max = 2 μm
x = 1231 μm
y = 1280 μm
MF1S5009
Product data sheet
PUBLIC
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 27 July 2010
189131
© NXP B.V. 2010. All rights reserved.
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