MF1PLUS6001DA4/03 データシートの表示（PDF） - NXP Semiconductors.

部品番号

コンポーネント説明

メーカー

MF1PLUS6001DA4/03

Mainstream contactless smart card IC for fast and easy solution development

NXP Semiconductors. 

NXP Semiconductors

5. Ordering information

Table 2. Ordering information

Type number

Package

Commercial

name

MF1PLUS8001DUD/03 FFC

Name

-

MF1PLUS8011DUD/03 FFC

-

MF1PLUS8031DUD/03 FFC

-

MF1PLUS8001DA4/03 MOA4

MF1PLUS8011DA4/03 MOA4

MF1PLUS8031DA4/03 MOA4

MF1PLUS6001DUD/03 FFC

PLLMC

PLLMC

PLLMC

-

MF1PLUS6011DUD/03 FFC

-

MF1PLUS6031DUD/03 FFC

-

MF1PLUS6001DA4/03 MOA4

MF1PLUS6011DA4/03 MOA4

MF1PLUS6031DA4/03 MOA4

MF1PLUS8001DUD/13 FFC

PLLMC

PLLMC

PLLMC

-

MF1PLUSx0y1

Mainstream contactless smart card IC

Description

Version

8 inch wafer (sawn; 120 µm thickness, on film -

frame carrier; electronic fail die marking

according to SECS-II format) see Ref. 3,

4 kB EEPROM, 7-byte UID, L1 card

8 inch wafer (sawn; 120 µm thickness, on film -

frame carrier; electronic fail die marking

according to SECS-II format) see Ref. 3,

4 kB EEPROM, 4-byte UID, L1 card

8 inch wafer (sawn; 120 µm thickness, on film -

frame carrier; electronic fail die marking

according to SECS-II format) see Ref. 3,

4 kB EEPROM, 4-byte NUID, L1 card

plastic leadless module carrier package; 35 mm SOT500-2

wide tape, 4 kB EEPROM, 7-byte UID, L1 card

plastic leadless module carrier package; 35 mm SOT500-2

wide tape, 4 kB EEPROM, 4-byte UID, L1 card

plastic leadless module carrier package; 35 mm SOT500-2

wide tape, 4 kB EEPROM, 4-byte NUID, L1 card

8 inch wafer (sawn; 120 µm thickness, on film -

frame carrier; electronic fail die marking

according to SECS-II format) see Ref. 3,

2 kB EEPROM, 7-byte UID, L1 card

8 inch wafer (sawn; 120 µm thickness, on film -

frame carrier; electronic fail die marking

according to SECS-II format) see Ref. 3,

2 kB EEPROM, 4-byte UID, L1 card

8 inch wafer (sawn; 120 µm thickness, on film -

frame carrier; electronic fail die marking

according to SECS-II format) see Ref. 3,

2 kB EEPROM, 4-byte NUID, L1 card

plastic leadless module carrier package; 35 mm SOT500-2

wide tape, 2 kB EEPROM, 7-byte UID, L1 card

plastic leadless module carrier package; 35 mm SOT500-2

wide tape, 2 kB EEPROM, 4-byte UID, L1 card

plastic leadless module carrier package; 35 mm SOT500-2

wide tape, 2 kB EEPROM, 4-byte NUID, L1 card

8 inch wafer (sawn; 120 µm thickness, on film -

frame carrier; electronic fail die marking

according to SECS-II format) see Ref. 3,

4 kB EEPROM, 7-byte UID, no security level 1 or

2, L3 card

MF1PLUSX0Y1_SDS

Product short data sheet

PUBLIC

All information provided in this document is subject to legal disclaimers.

Rev. 3.2 — 21 February 2011

163532

© NXP B.V. 2011. All rights reserved.

3 of 20

Share Link: