MF1SPLUS6001DA4/03 データシートの表示（PDF） - NXP Semiconductors.

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MF1SPLUS6001DA4/03

Mainstream contactless smart card IC for fast and easy solution development

NXP Semiconductors. 

NXP Semiconductors

MF1SPLUSx0y1

Mainstream contactless smart card IC

5. Ordering information

Table 2. Ordering information

Type number

Package

Commercial Name Description

Name

Version

MF1SPLUS8001DUD/03 FFC

-

8 inch wafer (sawn; 120 µm thickness, on film frame

-

carrier; electronic fail die marking according to SECS-II

format) see Ref. 3, 4 kB EEPROM, 7-byte UID

MF1SPLUS8011DUD/03 FFC

-

8 inch wafer (sawn; 120 µm thickness, on film frame

-

carrier; electronic fail die marking according to SECS-II

format) see Ref. 3, 4 kB EEPROM, 4-byte UID

MF1SPLUS8031DUD/03 FFC

-

8 inch wafer (sawn; 120 µm thickness, on film frame

-

carrier; electronic fail die marking according to SECS-II

format), 4K EEPROM, 4-byte NUID

MF1SPLUS8001DA4/03 MOA4

PLLMC plastic leadless module carrier package; 35 mm wide tape, SOT500-2

4 kB EEPROM, 7-byte UID

MF1SPLUS8011DA4/03 MOA4

PLLMC plastic leadless module carrier package; 35 mm wide tape, SOT500-2

4 kB EEPROM, 4-byte UID

MF1SPLUS8031DA4/03 MOA4

PLLMC plastic leadless module carrier package; 35 mm wide tape, SOT500-2

4K EEPROM, 4-byte NUID

MF1SPLUS6001DUD/03 FFC

-

8 inch wafer (sawn; 120 µm thickness, on film frame

-

carrier; electronic fail die marking according to SECS-II

format) see Ref. 3, 2 kB EEPROM, 7-byte UID

MF1SPLUS6011DUD/03 FFC

-

8 inch wafer (sawn; 120 µm thickness, on film frame

-

carrier; electronic fail die marking according to SECS-II

format) see Ref. 3, 2 kB EEPROM, 4-byte UID

MF1SPLUS6031DUD/03 FFC

-

8 inch wafer (sawn; 120 µm thickness, on film frame

-

carrier; electronic fail die marking according to SECS-II

format), 2K EEPROM, 4byte NUID

MF1SPLUS6001DA4/03 MOA4

PLLMC plastic leadless module carrier package; 35 mm wide tape, SOT500-2

2 kB EEPROM, 7-byte UID

MF1SPLUS6011DA4/03 MOA4

PLLMC plastic leadless module carrier package; 35 mm wide tape, SOT500-2

2 kB EEPROM, 4-byte UID

MF1SPLUS6031DA4/03 MOA4

PLLMC plastic leadless module carrier package; 35 mm wide tape, SOT500-2

2K EEPROM, 4-byte NUID

MF1SPLUSX0Y1_SDS

Product short data sheet

PUBLIC

All information provided in this document is subject to legal disclaimers.

Rev. 3.2 — 21 February 2011

187032

© NXP B.V. 2011. All rights reserved.

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