KA7777D データシートの表示（PDF） - KOA Speer Electronics, Inc.
部品番号
コンポーネント説明
メーカー
KA7777D Datasheet PDF : 1 Pages
| |||
NEW
KA, SC
hybrid IC
EU
features
• Adjustment processes are decreased
by function and ratio trimmings
• High density mounting by bonding (COB)
• Various types of package are available
• High reliability achieved by KOA’s original thick
film technology
• Thick film printed circuit substrate applies the non-noble
metal paste (conductive paste and resistive paste) and
receives the many total inquires including material
selecting, pattern designing and mass production
NoErWdering information
New Part #
KA
7777
Product
Code
KA: Hybrid IC
SC: Non-Noble
KOA Ref.
Number
D
Terminal Surface
Material
D: SnAgCu
T: Sn
Component - KA/CB Series
Substrate Materials
Conductors, Resistors
Mounting
Package, Outside Terminals
Over Coating, Plating
Item
AI2O3 Alumina
Glass epoxy
Item
Conductor resistance
Heat shock
RuO2
Item
COB
BGA
QFP
Chip
Package
SIP
DIP, SOP
ZIP
Over Coating
Epoxy metamorphic phenol
Epoxy
o= Available x= Not available
Printing
Mounting
o
o
x
o
Ag-Pd
18mΩ/ /15µmµ
Ag-Pt
5mΩ/ /10µm
-55°C~+125°C 300 Cycles -55°C~+125°C 500 Cycles
5Ω~10MΩ ±100x10-6/K
Specifications
Au Wire, AI Wire
0.8mm Pitch~
0.4mm Pitch~
0.6mm x 0.3mm (0.4mm x 0.2mm)~
Lead Pitch
1.8mm, 2.0mm, 2.5mm, 2.54mm
1.27mm, 1.8mm, 2.54mm
2.54mm
Color
Black
Black
Bonding
o
o
Cu
2mΩ/ /20µm
-55°C~+125°C 500 Cycles
10Ω~1MΩ ±100x10-6/k
UL Standard
94 V0 Approved
94 V1 Approved
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.
1/08/09
KOA Speer Electronics, Inc. • 199 Bolivar Drive • Bradford, PA 16701 • USA • 814-362-5536 • Fax: 814-362-8883 • www.koaspeer.com
249
Share Link: 