VS-751(2009) データシートの表示（PDF） - Vectron International
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VS-751 Datasheet PDF : 8 Pages
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Reliability
VI qualification includes aging at various extreme temperatures, shock and vibration, temperature cycling, and IR reflow
simulation. The VS-751 family is capable of meeting the following qualification test at right:
Parameter
Mechanical Shock
Mechanical Vibration
Solderability
Gross and Fine Leak
Resistance to Solvents
Environmental Compliance
Conditions
MIL-STD-883, Method 2002
MIL-STD-883, Method 2007
MIL-STD-883, Method 2003
MIL-STD-883, Method 1014
MIL-STD-883, Method 2016
Handling Precautions
Although ESD protection circuitry has been designed into the VS-751 proper precautions should be taken when handling and
ounting. VI employs a human body model (HBM) and a charged-device model (CDM) for ESD susceptibility testing and design
protection evaluation.
Model
Human Body Model
Charged Device Model
ESD Ratings
Minimum
1500V
1000V
Conditions
MIL-STD-883, Method 3015
JEDEC, JESD22-C101
Parameter
PreHeat Time
Ramp Up
Time Above 217 °C
Time To Peak Temperature
Time at 260 °C
Ramp Down
Reflow Profile (IPC/JEDEC J-STD-020C)
Symbol
t
S
R
UP
t
L
T
AMB-P
t
P
R
DN
Value
60 sec Min, 180 sec Max
3 °C/sec Max
60 sec Min, 150 sec Max
480 sec Max
20 sec Min, 40 sec Max
6 °C/sec Max
The device has been qualified to meet the JEDEC standard
for Pb-Free assembly. The temperatures and time intervals
listed are based on the Pb-Free small body requirements.
The temperatures refere to the topside of the package,
measured on the package body surface. The VS-751 device is
hermetically sealed so an aqueous wash is not an issue.
Terminal Plating: Electroless Gold Plate over Nickel Plate
Page5 of 8
Vectron International • 267 Lowell Road, Hudson, NH 03051 • Tel: 1-88-VECTRON-1 • http://www.vectron.com
Rev: 11/12/2009
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