LA76834 データシートの表示（PDF） - SANYO -> Panasonic

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LA76834

Announcement of Changes to Inner Box Markings and Pin Plating Associated ith Switching to Lead-Free Specifications for IC Pins (Products Affected: BIP Through Hole Devices)

SANYO -> Panasonic 

Continued from preceding page.

[Details]

(1) Notes on the heat resistance of lead-free products.

Heat resistance temperature profile of lead-free products

Lead-free production

Flow

260°C, 10s

Hand Solder 380°C, 3s

(2) Examples of lead-free product labeling

"-E" added to the end of type number

Non lead-free production (conventional)

260°C, 10s

350°C, 3s

(P) TYPE

--E

( 000000--000000

(IT) L01 12345

13

(Q) QIY 123456

(Z) SPECIAL

)

LEAD FREE

Z 12345678901

ASSEMBLY

(DIFFUSION

"LEAD FREE" indication

Indication

(3) Notes on solderability

Evaluation Sample: SIP-10 (Material: Cu) and SIP-16 (Material: 42 Alloy)

Evaluation solder Temperature/Time Flux

Sn-Pb

Sn-Pb (Current Product) Sn-3.0Ag-0.5Cu

230°C/3s

245°C/3s

Used (RMA type)

Used (RMA type)

Sn/Sn-Bi Plating

Sn-Pb

230°C/3s

Used (RMA type)

(Lead-free Product)

Sn-3.0Ag-0.5Cu 245°C/3s

Used (RMA type)

*1: Acceptability criteria: More than 95% of bathing area must be wet with solder.

Result *1

Passed

Passed

Passed

Passed

(4) Plated joint strength (reference data)

100

80

Sn-Pb Solder

60

Sn-Ag-Cu Solder

40

20

0

Temperature Cycle

Type of Plating

0

1000

Sn-Pb

0

1000

Sn/Sn-2.5Bi

0

1000

Sn-Pb

0

1000

Sn/Sn-2.5Bi

• Test equipment: Hooking extension tester

• Evaluation board: Glass-epoxy resin

• Temperatare cycle condition: -40°C (30 minute hold) to +125°C (30 minute hold)

• SANYO acceptance criteria: The joint strength after 1000 cycles must be at least 50% of the initial strength.

Note: The results shown above are for reference and do not constitute a guarantee.

No.8003-2/5

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