MT29F8G16AJADAHCIT データシートの表示（PDF） - Micron Technology
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MT29F8G16AJADAHCIT Datasheet PDF : 132 Pages
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Micron Confidential and Proprietary
4Gb, 8Gb, 16Gb: x8, x16 NAND Flash Memory
Package Dimensions
Figure 6: 63-Ball VFBGA (10.5mm x 13mm)
Seating
plane
0.12 A
A
63X Ø0.45
Solder ball material:
SAC305 (96.5% Sn,
3% Ag, 0.5% Cu).
Dimensions apply to
solder balls post-
reflow on Ø0.4 SMD
ball pads.
10 9 8 7 6 5 4 3 2 1
8.8 CTR
0.8 TYP
0.65 ±0.05
Ball A1 ID
A
B
C
D
E
F
13 ±0.1
G
H
J
K
L
M
Ball A1 ID
0.8 TYP
7.2 CTR
10.5 ±0.1
1.0 MAX
0.25 MIN
Bottom side saw fiducials may or
may not be covered with soldermask.
Note: 1. All dimensions are in millimeters.
PDF: 09005aef83b25735
m60a_4gb_8gb_16gb_ecc_nand.pdf - Rev. N 10/12 EN
13
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2009 Micron Technology, Inc. All rights reserved.
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