TDA7268
Fig. 1: Standard Test and Application Circuit
1 VS1
VS=12V
C1 0.1µF
IN1 4
IN1
+
2 OUT1
C4
100µF
R1
-
10K
C5
470µF
8Ω
8 VS2
t(s) C2 0.1µF
IN2 5
IN2
+
C6 470µF
7 OUT2
uc R2
-
d 10K
ro ) SVR 3
P t(s 8Ω
S1
lete duc STAND-BY
C3
47µF
6
S-GND
9÷16
P-GND
D94AU168D
so ro Note: Add R1 & R2 on demoboard only for DC tests.
OObbssoolleettee PPrroodduucctt((ss)) -- OObbsolete P Fig. 2: PCB And Components Layout Of The Application Circuit of Figure 1
APPLICATION HINTS:
For 12V supply and 8Ω speaker application, its
maximum power dissipation is about 2W.
Assumming that max ambient temperature is
70°C. Required thermal resistance of the device
and heat dissipating means must be equal to (150
4/6
- 70)/2 = 40°C/W.
Junction to pin thermal resistance of the package
is about 15°C/W.
That means external heat sink of about 25°C/W is
required. Stand-By switches must be able to dis-
charge Csvr current.