LA4192 データシートの表示（PDF） - SANYO -> Panasonic

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LA4192

1 to 2.3W 2-Channel of Power Amplifier

SANYO -> Panasonic 

LA4192

• Caution for LA4192 in sets

When LA4192 is used in a set and driven by AC mains, switching the motor on as shwon below, causes instantaneous

lowering of the power supply voltage, depending on the transformer regulation and other conditions.

Ripple noises are sometimes generated in the speakers or headphones. The following can be used to prevent such prob-

lems.

1. Connect a diode (a rectifier diode with an average

rectified current IO=100 to 200mA) across pins 6

and 12 of LA4192, and have pin 6 potential closely

follow power supply voltage variations. In a steady

state, this diode will be cut off.

2. Use large enough capacitance capacitors for the

power supply to suppress supply votage variations

caused when the motor is switched on.

• Heat sink design

As the package is basically heat-dissipated by utilizing a copper foil section of the printed circuit board, the area of

copper foil in the vicinity of the IC heat dissipating plate should be made as broad in area as possible when designing the

printed circuit board. For the sample printed pattern shown earlier, providing copper coil where indicated by the broken

lines will considerably enhance heat sinking. Power consumption (Pd) can be increased depending on power supply

voltage and load conditions. Use of a heat sink in conjunction with the printed circuit board is recommended. Described

below are formulas to provide guidelines for Pd (for 2 channels) under various conditions of usage. For AC power

supplies, it is preferable to take actual measurements at the transformer of sets. For bridge amplifier, simply use 1/2 of

employed loads in computations.

1) DC power supply

Pd max=

VCC2

π2RL

+ICCO · VCC (for 2 channels) .............................................. (1)

2) AC power supply

VCC2 :

VCC (Pd) :

VCC1 :

Power supply voltage at no signal

Power supply voltage at Pd max

Power supply voltage at maximum output

r:

ICCO :

Voltage regulation VCC2–VCC1

VCC1

Quiescent current

Power supply voltage variation

Pd max=

VCC(Pd)2

π2RL

+ICCO · VCC (Pd) (for 2 channels) ............................... (2)

where

VCC (Pd)=

1+

(1+r) VCC1

√ r · VCC1

√2 · π · RL

×

RL

PO max

Sample heat sink mounting

Prepare a heat sink as shown on the next page. It is configured to be able to dissipate heat both from the IC plastic surface

and its fins. Solder it on to the printed circuit board. Refer to the Pd – Ta characteristics for size of heat sink. Solderable

copper or steel are preferable. Silicone grease is recommended for application to the IC plastic surface to lower its

thermal resistance with the heat sink.

No.919–6/11

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