UPD16510GR-8JG データシートの表示（PDF） - NEC => Renesas Technology

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UPD16510GR-8JG

VERTICAL DRIVER FOR CCD SENSOR

NEC => Renesas Technology 

µPD16510

RECOMMENDED SOLDERING CONDITIONS

When soldering this product, it is highly recommended to observe the conditions as shown below. If other soldering

processes are used, or if the soldering is performed under different conditions, please make sure to consult with our

sales offices.

For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL”

(C10535E).

Surface mount device

µPD16510GR-8JG: 20-pin plastic shrink SOP (225 mil)

Process

Infrared ray reflow

VPS

Wave soldering

Partial heating method

Conditions

Peak temperature: 235 °C or below (Package surface temperature),

Reflow time: 30 seconds or less (at 210 °C or higher),

Maximum number of reflow processes: 3 times.

Peak temperature: 215 °C or below (Package surface temperature),

Reflow time: 40 seconds or less (at 200 °C or higher),

Maximum number of reflow processes: 3 times.

Solder temperature: 260 °C or below, Flow time: 10 seconds or less,

Maximum number of flow processes: 1 time,

Pre-heating temperature: 120 °C or below (Package surface temperature).

Pin temperature: 300 °C or below,

Heat time: 3 seconds or less (Per each side of the device).

Symbol

IR35-00-3

VP15-00-3

WS60-00-1

—

Caution Apply only one kind of soldering condition to a device, except for “partial heating method”, or the

device will be damaged by heat stress.

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