2N7002F(2002) データシートの表示（PDF） - Philips Electronics

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2N7002F
(Rev.:2002)

TrenchMOS™ Logic Level FET

Philips Electronics 

Philips Semiconductors

2N7002F

TrenchMOS™ Logic Level FET

7. Thermal characteristics

Table 4: Thermal characteristics

Symbol Parameter

Conditions

Min Typ Max Unit

Rth(j-sp) thermal resistance from junction to solder point mounted on a metal clad board; Figure 4 - - 150 K/W

Rth(j-a) thermal resistance from junction to ambient

mounted on a printed circuit board;

minimum footprint

- - 350 K/W

7.1 Transient thermal impedance

103

Zth(j-sp)

K/W

102

δ = 0.5

0.2

0.1

10

0.05

0.02

1

single pulse

10-1

10-5

10-4

10-3

10-2

10-1

03ai09

P

δ

=

tp

T

tp

t

T

1

10

tp (s)

Mounted on metal clad substrate.

Fig 4. Transient thermal impedance from junction to solder point as a function of pulse duration.

9397 750 09096

Product data

Rev. 01 — 11 February 2002

© Koninklijke Philips Electronics N.V. 2002. All rights reserved.

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