33291L データシートの表示（PDF） - Freescale Semiconductor

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33291L

Eight-Output Switch with Serial Peripheral Interface I/O

Freescale Semiconductor 

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

Table 3. Maximum Ratings

All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or

permanent damage to the device.

Rating

Symbol

Value

Unit

Power Supply Voltage

Normal Operation (Steady-State)

Transient Conditions (1)

Logic Supply Voltage (2)

Input Pin Voltage (3)

Output Clamp Voltage (4)

5.0 mA ≤ IOUT ≤ 0.5 A

V

VPWR(SUS)

VPWR(PK)

-1.5 to 26.5

-13 to 60

VDD

-0.3 to 7.0

V

VIN

-0.3 to 7.0

V

VOUT(OFF)

V

45 to 65

Output Self-Limit Current

Continuous Per Output Current (5)

ESD Voltage (6) (7)

Human Body Model

Machine Model

Output Clamp Energy (8)

Recommended Frequency of SPI Operation

Storage Temperature

Operating Case Temperature

Operating Junction Temperature

Power Dissipation (TA = 25°C) (9)

IOUT(LIM)

IOUT(CONT)

VESD1

VESD2

ECLAMP

fSPI

TSTG

TC

TJ

PD

1.0 to 3.0

500

±2000

±200

50

3.0

-55 to 150

-40 to 125

-40 to 150

2.0

A

mA

V

mJ

MHz

°C

°C

°C

W

Notes

1. Transient capability with external 100 Ω resistor in series with VPWR pin and supply.

2. Exceeding these limits may cause a malfunction or permanent damage to the device.

3. Exceeding the limits on SCLK, SI, CS, SFPD, or RST pins may cause permanent damage to the device.

4. With output OFF.

5. Continuous output current rating so long as maximum junction temperature is not exceeded. Operation at 125°C ambient temperature

will require maximum output current computation using package RθJA.

6. ESD data available upon request.

7. ESD1 testing is performed in accordance with the Human Body Model (CZAP = 200 pF, RZAP = 1500 Ω), ESD2 testing is performed in

accordance with the Machine Model (CZAP = 200pF, RZAP = 0 Ω).

8. Maximum output clamp energy capability at 150°C junction temperature using a single non-repetitive pulse method.

9. Maximum power dissipation at indicated junction temperature with no heat sink used.

33291L

4

Analog Integrated Circuit Device Data

Freescale Semiconductor

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