541 データシートの表示（PDF） - Intel

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541

Intel® Pentium® 4 Processors Supporting Hyper-Threading Technology

Intel 

Contents

Contents

1 Introduction.................................................................................................................................... 11

1.1 Terminology ........................................................................................................................ 12

1.1.1 Processor Packaging Terminology ........................................................................ 12

1.2 References ......................................................................................................................... 13

2 Electrical Specifications ................................................................................................................. 15

2.1 FSB and GTLREF............................................................................................................... 15

2.2 Power and Ground Lands................................................................................................... 15

2.3 Decoupling Guidelines........................................................................................................ 15

2.3.1 VCC Decoupling .................................................................................................... 16

2.3.2 FSB GTL+ Decoupling........................................................................................... 16

2.3.3 FSB Clock (BCLK[1:0]) and Processor Clocking ................................................... 16

2.4 Voltage Identification .......................................................................................................... 17

2.4.1 Phase Lock Loop (PLL) Power and Filter .............................................................. 19

2.5 Reserved, Unused, FC and TESTHI Signals...................................................................... 20

2.6 FSB Signal Groups ............................................................................................................. 21

2.7 GTL+ Asynchronous Signals ..............................................................................................22

2.8 Test Access Port (TAP) Connection ................................................................................... 23

2.9 FSB Frequency Select Signals (BSEL[2:0]) ....................................................................... 23

2.10 Absolute Maximum and Minimum Ratings ......................................................................... 24

2.11 Processor DC Specifications ..............................................................................................24

2.12 VCC Overshoot Specification ............................................................................................. 33

2.12.1 Die Voltage Validation ........................................................................................... 33

2.13 GTL+ FSB Specifications....................................................................................................34

3 Package Mechanical Specifications ..............................................................................................35

3.1 Package Mechanical Drawing ............................................................................................ 35

3.2 Processor Component Keep-Out Zones............................................................................. 39

3.3 Package Loading Specifications......................................................................................... 39

3.4 Package Handling Guidelines............................................................................................. 39

3.5 Package Insertion Specifications........................................................................................ 40

3.6 Processor Mass Specification............................................................................................. 40

3.7 Processor Materials ............................................................................................................ 40

3.8 Processor Markings ............................................................................................................ 40

3.9 Processor Land Coordinates ..............................................................................................41

4 Land Listing and Signal Descriptions ............................................................................................ 43

4.1 Processor Land Assignments ............................................................................................. 43

4.2 Alphabetical Signals Reference .......................................................................................... 66

5 Thermal Specifications and Design Considerations ...................................................................... 75

5.1 Processor Thermal Specifications ...................................................................................... 75

5.1.1 Thermal Specifications .......................................................................................... 75

5.1.2 Thermal Metrology ................................................................................................. 79

5.2 Processor Thermal Features ..............................................................................................79

5.2.1 Thermal Monitor..................................................................................................... 79

5.2.2 Thermal Monitor 2.................................................................................................. 80

Datasheet

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