56F803 データシートの表示（PDF） - Freescale Semiconductor
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56F803 Datasheet PDF : 52 Pages
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General Characteristics
Table 3-2 Recommended Operating Conditions
Characteristic
Voltage difference VSS to VSSA
ADC reference voltage
Ambient operating temperature
Symbol
Min
ΔVSS
-0.1
VREF
2.7
TA
–40
Typ
Max
Unit
-
0.1
V
–
VDDA
V
–
85
°C
Characteristic
Junction to ambient
Natural convection
Junction to ambient (@1m/sec)
Junction to ambient
Natural convection
Junction to ambient (@1m/sec)
Junction to case
Junction to center of case
I/O pin power dissipation
Power dissipation
Junction to center of case
Table 3-3 Thermal Characteristics6
Comments
Symbol
Value
100-pin LQFP
RθJA
41.7
Unit Notes
°C/W
2
Four layer board (2s2p)
Four layer board (2s2p)
RθJMA
37.2
°C/W
2
RθJMA
(2s2p)
34.2
°C/W 1,2
RθJMA
32
°C/W 1,2
RθJC
10.2
°C/W
3
ΨJT
0.8
°C/W 4, 5
P I/O
User Determined
W
PD
P D = (IDD x VDD + P I/O)
W
PDMAX
(TJ - TA) /RθJA
W
7
Notes:
1. Theta-JA determined on 2s2p test boards is frequently lower than would be observed in an application.
Determined on 2s2p thermal test board.
2. Junction to ambient thermal resistance, Theta-JA (RθJA) was simulated to be equivalent to the JEDEC
specification JESD51-2 in a horizontal configuration in natural convection. Theta-JA was also simulated on
a thermal test board with two internal planes (2s2p where “s” is the number of signal layers and “p” is the
number of planes) per JESD51-6 and JESD51-7. The correct name for Theta-JA for forced convection or with
the non-single layer boards is Theta-JMA.
3. Junction to case thermal resistance, Theta-JC (RθJC ), was simulated to be equivalent to the measured values
using the cold plate technique with the cold plate temperature used as the “case” temperature. The basic cold
plate measurement technique is described by MIL-STD 883D, Method 1012.1. This is the correct thermal
metric to use to calculate thermal performance when the package is being used with a heat sink.
56F803 Technical Data, Rev. 16
Freescale Semiconductor
19
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