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5962F9671801VXC データシートの表示(PDF) - Intersil

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5962F9671801VXC Datasheet PDF : 3 Pages
1 2 3
ACTS244MS
Die Characteristics
DIE DIMENSIONS:
100 x 100 (mils)
2.54 x 2.54 (mm)
METALLIZATION:
Type: AlSi
Metal 1 Thickness: 7.125kÅ ±1.125kÅ
Metal 2 Thickness: 9kÅ ±1kÅ
GLASSIVATION:
Type: SiO2
Thickness: 8kÅ ±1kÅ
WORST CASE CURRENT DENSITY:
< 2.0 x 105A/cm2
BOND PAD SIZE:
110 x 110 (µm)
4.4 x 4.4 (mils)
Metallization Mask Layout
AI1 AE
(2) (1)
ACTS244MS
VCC VCC
BE
(20) (20)
(19)
BO4 (3)
AI2 (4)
BO3 (5)
AI3 (6)
BO2 (7)
AI4 (8)
BO1 (9)
(10) (10)
GND GND
(18) AO1
(17) BI4
(16) AO2
(15) BI3
(14) AO3
(13) BI2
AO4 (12)
(11)
BI1
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate
and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
Spec Number 518784
3

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