Freescale Semiconductor, Inc.
Table of Contents
Section 8. Mechanical Specifications
8.1 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .81
8.2 Mechnical Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .81
8.3 Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .82
8.3.1 P Suffix, Plastic DIP, Case # 710-02 . . . . . . . . . . . . . . . . . .82
8.3.2 DW Suffix, SOIC, Case # 751F-02. . . . . . . . . . . . . . . . . . . .83
MC68HC05E1 — Revision 2.0
General Release Specification
Table of Contents
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