74HC04 データシートの表示（PDF） - ON Semiconductor
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74HC04 Datasheet PDF : 7 Pages
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74HC04
ÎÎMÎÎASyXÎÎmIMboUÎÎlM RÎÎATÎÎINGÎÎS ÎÎÎÎÎÎÎÎÎÎÎÎÎÎParÎÎameÎÎter ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎValuÎÎe ÎÎÎÎÎÎUniÎÎt
VCC
DC Supply Voltage (Referenced to GND)
Vin
DC Input Voltage (Referenced to GND)
Vout
DC Output Voltage (Referenced to GND)
Iin
DC Input Current, per Pin
Iout
DC Output Current, per Pin
ICC
DC Supply Current, VCC and GND Pins
PD
Power Dissipation in Still Air,
– 0.5 to + 7.0
V
– 0.5 to VCC + 0.5
V
– 0.5 to VCC + 0.5
V
±20
mA
±25
mA
±50
mA
SOIC Package†
500
mW
TSSOP Package†
450
Tstg
Storage Temperature
TL
Lead Temperature, 1 mm from Case for 10 Seconds
– 65 to + 150
_C
_C
SOIC or TSSOP Package
260
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
*This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be
taken to avoid applications of any voltage higher than maximum rated voltages to this high−impedance circuit. For proper operation, Vin and
Vout should be constrained to the range GND v (Vin or Vout) v VCC. Unused inputs must always be tied to an appropriate logic voltage level
(e.g., either GND or VCC). Unused outputs must be left open.
†Derating − SOIC Package: – 7 mW/_C from 65_ to 125_C
TSSOP Package: − 6.1 mW/_C from 65_ to 125_C
For high frequency or heavy load considerations, see Chapter 2 of the ON Semiconductor High−Speed CMOS Data Book (DL129/D).
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
VCC
Vin, Vout
TA
tr, tf
DC Supply Voltage (Referenced to GND)
DC Input Voltage, Output Voltage (Referenced to GND)
Operating Temperature, All Package Types
Input Rise and Fall Time
(Figure 1)
VCC = 2.0 V
VCC = 4.5 V
VCC = 6.0 V
Min
2.0
0
– 55
0
0
0
Max
Unit
6.0
V
VCC
V
+ 125
_C
1000
ns
500
400
ORDERING INFORMATION
Device
Package
Shipping†
74HC04DR2G
74HC04DTR2G
SOIC−14
(Pb−Free)
TSSOP−14*
2500 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*This package is inherently Pb−Free.
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