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FG315 データシートの表示(PDF) - STMicroelectronics

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コンポーネント説明
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FG315
ST-Microelectronics
STMicroelectronics ST-Microelectronics
FG315 Datasheet PDF : 10 Pages
1 2 3 4 5 6 7 8 9 10
Package information
STPS3150
Table 6. DO-201AD Package dimensions
DIMENSIONS
B
Note 1
A
E
E
B
Note 1
REF.
Millimeters Inches
Min. Max. Min. Max.
ØD
Note 2
ØC
A
9.50
0.374
B 25.40
1.000
C
5.30
0.209
D(1)
1.30
0.051
E
Note 2(2) 15
1.25
0.049
0.59
1. The lead diameter D is not controlled over zone E
2. The minimum length, which must stay straight between the right angles after bending, is 15 mm (0.59”)
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
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