ACPF-7001 データシートの表示（PDF） - HP => Agilent Technologies
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ACPF-7001 Datasheet PDF : 7 Pages
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Alloy type
Sn42Bi58
Sn43Pb43Bi14
Sn63Pb37
Sn60Pb40
Sn91/Zn9
Sn96.2Ag2.5Cu0.8Sb0.5
Sn95.8Ag3.5Cu0.7
Sn96.5Ag3.5
Sn100
Sn95Sb5
Sn97Cu3
Melting temp. (oC)
138
144 – 163
183
186
199
216
217
221
232
235
240
Recommended working
temperature (oC)
160 – 180
165 – 185
200 – 240
200 – 240
200 – 240
235 – 255
235 – 255
240 – 260
260 – 280
260 – 280
260 – 300
Comments
Lead free
Contains lead – some customers prohibit it
Contains lead – some customers prohibit it
Contains lead – some customers prohibit it
May have oxidation problems
Popular lead free composition
Other alloy ratios are available
Used in the assembly of filters
Too hot – will melt package assembly
Too hot – will melt package assembly
Too hot – will melt package assembly
250
217°C
200
125°C ± 25°C
150
100
120 sec. max.
50
235°C ± 5°C
10 to 20 sec.
60 to 120 sec.
3°C/sec. max
-6°C/sec. max
Guidelines
Tested profile
0
0
100
200
300
400
500
600
Time, seconds
Figure 11. Recommended solder profile.
www.agilent.com/semiconductors
For product information and a complete list of
distributors, please go to our web site.
For technical assistance call:
Americas/Canada: +1 (800) 235-0312 or
(408) 654-8675
Europe: +49 (0) 6441 92460
China: 10800 650 0017
Hong Kong: (+65) 6271 2451
India, Australia, New Zealand: (+65) 6271 2394
Japan: (+81 3) 3335-8152(Domestic/International), or
0120-61-1280(Domestic Only)
Korea: (+65) 6271 2194
Malaysia, Singapore: (+65) 6271 2054
Taiwan: (+65) 6271 2654
Data subject to change.
Copyright © 2003 Agilent Technologies, Inc.
Obsoletes 5988-6276EN
March 20, 2003
5988-8531EN
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