ACPM-5013 データシートの表示（PDF） - Avago Technologies
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ACPM-5013 Datasheet PDF : 14 Pages
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Metallization
0.30
0.60
on 0.5mm pitch
Ø 0.3mm
0.45
0.35
0.55
0.475
connected to a inner layer
through a via hole for a
better isolation between
CPL_IN(ISO) and RFout
Solder Mask Opening
0.65
0.45
0.50
1.30
0.60
0.525
1.50
Solder Paste Stencil Aperture
0.55
0.35
0.45
1.10
0.60
0.475
1.10
7
PCB Design Guidelines
The recommended PCB land pattern is shown in figures
on the left side. The substrate is coated with solder mask
between the I/O and conductive paddle to protect the
gold pads from short circuit that is caused by solder
bleeding/bridging.
Stencil Design Guidelines
A properly designed solder screen or stencil is required
to ensure optimum amount of solder paste is deposited
onto the PCB pads.
The recommended stencil layout is shown here. Reducing
the stencil opening can potentially generate more voids.
On the other hand, stencil openings larger than 100% will
lead to excessive solder paste smear or bridging across the
I/O pads or conductive paddle to adjacent I/O pads. Con-
sidering the fact that solder paste thickness will directly
affect the quality of the solder joint, a good choice is to
use laser cut stencil composed of 0.100 mm (4 mils) or
0.127 mm (5 mils) thick stainless steel which is capable of
producing the required fine stencil outline.
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