AD5755(2011) データシートの表示（PDF） - Analog Devices

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AD5755
(Rev.:2011)

Quad Channel, 16-Bit, Serial Input, 4 mA to 20 mA and Voltage Output DAC, Dynamic Power Control

Analog Devices 

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted. Transient currents of up to

100 mA do not cause SCR latch-up.

Table 4.

Parameter

AVDD, VBOOST_x to AGND, DGND

AVSS to AGND, DGND

AVDD to AVSS

AVCC to AGND

DVDD to DGND

Digital Inputs to DGND

Digital Outputs to DGND

REFIN, REFOUT to AGND

VOUT_x to AGND

+VSENSE_x, −VSENSE_x to AGND

IOUT_x to AGND

SWx to AGND

AGND, GNDSWx to DGND

Operating Temperature Range (TA)

Industrial1

Storage Temperature Range

Junction Temperature (TJ max)

64-Lead LFCSP

θJA Thermal Impedance2

Power Dissipation

Lead Temperature

Soldering

Rating

−0.3 V to +33 V

+0.3 V to −28 V

−0.3 V to +60 V

−0.3 V to +7 V

−0.3 V to +7 V

−0.3 V to DVDD + 0.3 V or +7 V

(whichever is less)

−0.3 V to DVDD + 0.3 V or +7 V

(whichever is less)

−0.3 V to AVDD + 0.3 V or +7 V

(whichever is less)

AVSS to VBOOST_x or 33 V if using

the dc-to-dc circuitry

AVSS to VBOOST_x or 33 V if using

the dc-to-dc circuitry

AVSS to VBOOST_x or 33 V if using

the dc-to-dc circuitry

−0.3 to +33 V

−0.3 V to +0.3 V

−40°C to +105°C

−65°C to +150°C

125°C

20°C/W

(TJ max − TA)/θJA

JEDEC industry standard

J-STD-020

1 Power dissipated on chip must be derated to keep the junction temperature

below 125°C.

2 Based on a JEDEC 4-layer test board.

AD5755

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

ESD CAUTION

Rev. 0 | Page 11 of 48

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