AD780CRZ-REEL7 データシートの表示（PDF） - Analog Devices
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AD780CRZ-REEL7 Datasheet PDF : 12 Pages
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AD780
Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Values
+VIN to Ground
TRIM Pin to Ground
TEMP Pin to Ground
Power Dissipation (25°C)
Storage Temperature
Lead Temperature
(Soldering 10 sec)
36 V
36 V
36 V
500 mW
−65°C to +150°C
300°C
Output Protection
ESD Classification
Output safe for indefinite short to
ground and momentary short to VIN.
Class 1 (1000 V)
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
conditions above those indicated in the operational sections of
this specification is not implied. Exposure to absolute
maximum specifications for extended periods may affect device
reliability.
NC 1
2.5V/3.0V O/PSELECT
8 (NC OR GND)
+VIN 2 AD780 7 NC
TEMP 3 TOP VIEW 6 VOUT
GND 4 (Not to Scale) 5 TRIM
NC = NO CONNECT
Figure 2. Pin Configuration, 8-Lead PDIP and SOIC Packages
GND TEMP
+VIN
GND
TRIM
VOUT
2.5V/3.0V
O/P SELECT
Figure 3. Die Layout
NOTES
Both VOUT pads should be connected to the output.
Die Thickness: The standard thickness of Analog Devices
bipolar dice is 24 mil ± 2 mil.
Die Dimensions: The dimensions given have a tolerance of
±2 mil.
Backing: The standard backside surface is silicon (not plated).
Analog Devices does not recommend gold-backed dice for most
applications.
Edges: A diamond saw is used to separate wafers into dice, thus
providing perpendicular edges halfway through the die. In
contrast to scribed dice, this technique provides a more uniform
die shape and size. The perpendicular edges facilitate handling
(such as tweezer pickup), while the uniform shape and size
simplify substrate design and die attach.
Top Surface: The standard top surface of the die is covered by a
layer of glassivation. All areas are covered except bonding pads
and scribe lines.
Surface Metallization: The metallization to Analog Devices
bipolar dice is aluminum. Minimum thickness is 10,000 Å.
Bonding Pads: All bonding pads have a minimum size of
4.0 mil by 6.0 mil. The passivation windows have a minimum
size of 3.6 mil by 5.6 mil.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. F | Page 4 of 12
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